FREMONT, Calif.: #AI--Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today that it has received multiple orders of its VertaCure PLP systems for advanced packaging from a leading semiconductor manufacturer in Japan. These systems will be utilized in the manufacturing of AI and HPC solutions, where they will support 2.5D/3D packaging. YES products have a long history of demonstrating superior quality of curing, coating and annealing for both R&D environments and high volume manufacturing flows.

VertaCure PLP is a fully automated vacuum curing system that provides complete removal of residual solvents, uniform temperature distribution, and precise management of heating and cooling rates. Its benefits also include no outgassing after cure and excellent particle performance. This tool supports various panel sizes, including 600 mm x 600 mm, 510 mm x 515 mm and 300 mm x 300 mm.

“Today’s AI and HPC solutions are moving to a chiplet based architecture that provides better performance, larger memory and allows more heat dissipation. These solutions also require larger substrates,” said Saket Chadda, SVP of Dry BU at YES. “To accommodate these large substrate sizes and increasing bandwidth requirements, the semiconductor industry is moving to panel-based substrates. VertaCure PLP is a production proven automated vacuum cure system that provides superior film performance, and a much higher throughput than atmospheric curing. It has a multi-zone temperature control system with laminar flow for excellent uniformity and particle performance required for Polyimide, PBO and build-up layer cure, as well as bonding anneal. It also delivers superior mechanical, thermal and electrical properties for a large variety of polymers for wafer-level packaging that are critical for AI and HPC related applications,” added Chadda.

According to Alex Chow, SVP Worldwide Sales and Business Development at YES, “This significant purchase order firmly establishes our position as the market leader for curing tools. Our VertaCure PLP product line is well known for offering a controlled, reproducible and scalable manufacturing process for bonding and polymer cure applications. This system provides superior quality and total cost of ownership for our customers, particularly for the manufacturing of advanced 2.5D and 3D packaging solutions for the semiconductor industry.”

About YES

YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.

Fonte: Business Wire