Industry Experts Offer Insight into Skyrocketing Chiplet Industry
SANTA CLARA, Calif.: #AdvancedPackaging--Chiplet Summit, the biggest conference totally dedicated to chiplets, today announced the keynotes for its fourth annual event, February 17-19, at the Santa Clara Convention Center.
“We have remarkable keynotes for the largest Chiplet Summit ever. They will highlight how chiplets are reshaping the semiconductor industry,” said Chuck Sobey, General Chair of Chiplet Summit.
Wednesday Keynotes:
- Abhijeet Chakraborty, VP Engineering, Synopsys – Leads multi-die and 3D heterogeneous integration technologies. Will discuss how AI is improving multi-die design through advanced automation and intelligent design integration.
- Letizia Giuliano, VP Product Marketing/Management, Alphawave Semi – Specializes in high-speed connectivity and chiplet system design. Will cover the progression from early chiplet adoption to mainstream deployment in scalable, interoperable system-level architectures.
- Juan C. Rey, Sr VP, Siemens EDA – GM Calibre Segment. Will examine barriers to 3D IC performance and introduce AI-driven strategies to accelerate design convergence and reduce costs.
- Debendra Das Sharma, Board Member, UCIe – Co-inventor of UCIe. Will highlight advances in chiplet interconnect standards and their role in enabling modular, scalable systems.
Thursday Keynotes:
- David Glasco, VP Compute Solutions Group, Cadence – Oversees hardware/software design and implementation of soft IP for AI. Will present modular multi-die designs for AI, edge, and physical AI applications.
- Imran Yusuf, Director Hardware Ecosystem, Arm – Leads strategic alliances and business development for hardware ecosystems. Will highlight how chiplet-based infrastructure enables modular, flexible, and efficient AI/cloud systems.
- Cliff Grossner, Chief Innovation Officer, OCP, & Anu Ramamurthy, Associate Fellow, Microchip Technology – Grossner leads market intelligence and new programs; Ramamurthy co-leads OCP’s Open Chiplet Economy sub-group. They will cover the next wave of AI inference focused on low-cost, interoperable chiplet ecosystems for cloud and edge infrastructure.
- Jim Rogers, Sr VP Custom Cloud Solutions, Marvell – Leads custom silicon strategy for hyperscalers. Will review innovations in chiplet-based memory, connectivity, 3D packaging, and integrated optics that will help meet AI datacenter power constraints.
More information on the keynotes is at: https://chipletsummit.com/2026-keynotes-and-special-presentations-2/
To discuss exhibiting, contact:
David Blaza
Exhibit Sales Director
David@ChipletSummit.com
+1.512.736.3171
About Chiplet Summit
Chiplet Summit, a product of Semper Technologies, is the largest event entirely dedicated to the emerging chiplet market. It features the innovators and companies using chiplets in designs for processors, memories, communications chips, and AI devices. For more information, visit www.chipletsummit.com.
Fonte: Business Wire