Toshiba Showcases Advanced Power Semiconductor Solutions at APEC 2026

Toshiba America Electronic Components, Inc., a global innovator in semiconductors and storage solutions, will be at the Applied Power Electronics Conference (APEC) this week to highlight its latest po...

IRVINE, Calif.: Toshiba America Electronic Components, Inc., a global innovator in semiconductors and storage solutions, will be at the Applied Power Electronics Conference (APEC) this week to highlight its latest power semiconductor technologies enabling more intelligent, efficient, and sustainable system designs.

The premier event for the power electronics industry, APEC brings together designers, manufacturers, researchers, and industry leaders to explore the technologies shaping the future of energy conversion and power management. Toshiba will demonstrate how its broad portfolio supports next-generation applications across automotive, data center, industrial, infrastructure, defense and medical markets.

Toshiba semiconductors sit at the core of the systems shaping modern life – and those being built for the future – from electric mobility and renewable energy to hyperscale data centers. The company’s extensive portfolio includes silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) FETs; IGBTs; optical and digital isolation devices; motor control solutions; microcontrollers (MCUs); protection ICs such as eFuses; and a wide range of other general-purpose semiconductor devices.

In high-density data centers, Toshiba solutions help reduce power loss and simplify thermal management. In electric vehicles, they contribute to improved system efficiency and extended range. In both cases, the focus is on meeting performance requirements while supporting reliability and energy efficiency.

At APEC 2026, Toshiba will feature several new products and technology updates, including:

UMOS™ 11 MOSFETs – Expanded portfolio in industry-standard packages featuring improved switching characteristics and reduced RDS(on) per area compared to the previous UMOS™ 10 generation.
Top-side cooled TOGT package – Engineered for thermally demanding, high power-density applications, enabling heat dissipation through the top of the package to reduce thermal stress on the PCB.
SiC power modules – High-power modules for grid-level and industrial systems utilizing Toshiba’s latest silicon carbide process technology.
750V and 1200V SiC die and modules – Targeted for automotive drivetrain inverter applications, offering power-dense configurations adaptable to specific system requirements.
GaN devices – Ongoing development of low-voltage and high-voltage GaN technologies, with additional product updates planned later this year.
MCU, MCD, and SmartMCD™ devices – Microcontroller and motor control solutions designed for automotive body electronics, ECUs, and industrial control applications.
System reference designs – Demonstrations include high-efficiency power supply platforms such as 3kW server PSUs for data center applications, automotive ECU power architectures, and motor control reference designs for pump and power tool systems.

Toshiba’s vertically integrated manufacturing model and globally diversified supply chain provide customers with reliable, scalable, and cost-effective solutions for demanding applications. By owning its manufacturing processes, Toshiba delivers consistent quality and long-term supply stability – critical factors for automotive electrification and data center infrastructure growth.

APEC attendees are invited to visit Toshiba at booth #1753 from March 23-25 at the Henry B. Gonzalez Convention Center in San Antonio to learn more about the company’s latest power semiconductor innovations.

For additional information, please visit https://toshiba.semicon-storage.com/us/top.html or connect with Toshiba on LinkedIn.

About Toshiba America Electronic Components, Inc.

Toshiba America Electronic Components, Inc. (TAEC) is the North American semiconductor and storage business of Toshiba. The company offers a broad portfolio of discrete and integrated devices for automotive, data center, industrial, and infrastructure applications, including silicon, SiC, and GaN power devices; microcontrollers; motor control solutions; isolation and protection ICs; and storage products.

Supported by Toshiba’s global manufacturing network, TAEC provides reliable, scalable technologies designed to meet the performance, efficiency, and reliability requirements of demanding systems. Established in 1989, TAEC serves customers throughout North and Latin America with sales, marketing, and technical support.

Fonte: Business Wire