Flash Optimized for AI, Mobile, and Edge Devices with Enhanced Speed, Security, and Signal Integrity

ARLINGTON, Va.: JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced it is nearing completion of the next version of its highly anticipated Universal Flash Storage (UFS) standard: UFS 5.0. Designed for mobile applications and computing systems that demand high performance with low power consumption, UFS 5.0 plans to deliver faster data access and improved performance compared to its predecessor, while maintaining compatibility with UFS 4.x hardware.

UFS offers high-performance, embedded storage with low power consumption, making it ideal for use in applications where power efficiency is essential. This includes computing and mobile systems like smartphones and wearables, as well as an expanding role in automotive applications, edge computing and gaming consoles. Its high-speed serial interface and optimized protocol enable significant throughput for power-efficient system performance.

UFS 5.0 will include the following and other features:

• Increased sequential performance up to 10.8 GB/s to meet AI demands*
• Integrated link equalization for more reliable signal integrity*
• Distinct power supply rail to provide noise isolation between PHY and memory subsystem, easing system integration*
• Inline Hashing for greater security

*Features resulting from the collaboration between JEDEC and the MIPI® Alliance.

Stay tuned for more: JEDEC is continuing to evaluate features for further enhancements to the standard when published.

JEDEC encourages companies to join and help shape the future of JEDEC standards. JEDEC membership provides access to pre-publication proposals and early insights into active projects such as UFS 5.0 and more. Discover the benefits of membership and join today.

“JEDEC members are continually shaping the standards that will drive the next generation of mobile devices and advanced applications, and the committee’s dedication to ongoing improvements to the UFS series is paving the way for future innovation,” said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards.

Collaboration with the MIPI® Alliance

To achieve the highest performance and most power efficient data transport, JEDEC UFS leverages industry-leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continues with UFS 5.0, which leverages the upcoming MIPI M-PHY® version 6.0 specification and the UniPro® version 3.0 specification. M-PHY 6.0 introduces a new High-Speed Gear 6 (HS-G6), which supports data rates double those of the previous maximum data rate of HS-G5, enabling UFS interface bandwidth of 46.6 Gb/s per lane and supporting up to ~10.8 GB/s effective read/write operation for UFS 5.0 over 2 M-PHY lanes.

JEDEC standards are subject to change during and after the development process, including disapproval by the JEDEC Board of Directors.

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 360 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org.

Fonte: Business Wire