Accelsius, a leader in two-phase, direct-to-chip liquid cooling technology, today announced the general availability of the NeuCool® MR250, the company’s first row-based Coolant Distribution Unit (...

Purpose-built to deliver 250 kW of liquid cooling capacity, the MR250 debuts at the OCP Global Summit as the first in a series of multi-rack solutions for production-scale deployments
AUSTIN, Texas: Accelsius, a leader in two-phase, direct-to-chip liquid cooling technology, today announced the general availability of the NeuCool® MR250, the company’s first row-based Coolant Distribution Unit (CDU) and the latest advancement in scaling two-phase, direct-to-chip (2P D2C) liquid cooling for AI and high-performance computing (HPC) data centers. The MR250 will make its public debut at the Open Compute Project (OCP) Global Summit, October 13–16 in San Jose.
Purpose-built for the industry’s most demanding workloads, the MR250 delivers 250 kW of liquid cooling capacity per rack in flexible configurations (1 x 250 kW or 2 x 125 kW/rack). It is the first in a planned series of increasingly powerful NeuCool multi-rack solutions, with higher-capacity systems scheduled for release in 2026.
“The MR250 signals a new chapter for liquid cooling,” said Josh Claman, Accelsius’ CEO. “Two-phase, direct-to-chip solutions are no longer just proofs of concept. They are ready for the scale and reliability that modern data centers demand. With MR250, operators can deploy with confidence, knowing they’re reducing risk, maintenance and cost across the entire facility.”
By leveraging refrigerant-based cooling at scale, the MR250 reduces the need for constant water treatment and monitoring associated with single-phase systems. This shift mitigates leak risk, simplifies operations and protects IT assets while delivering greater reliability for mission-critical environments.
Additional benefits of the MR250 include:
Select deployments of the MR250 began late in the third quarter, with broader rollouts continuing through the fourth quarter and into 2026.
See the NeuCool MR250 at OCP Global Summit
The MR250 will debut at the Open Compute Project (OCP) Global Summit, October 13–16 in San Jose, at Booth B43.
Accelsius will also participate in the following sessions and events during OCP:
To learn more about Accelsius’ NeuCool two-phase, direct-to-chip, row-based liquid cooling solution, email info@accelsius.com or visit accelsius.com.
About Accelsius
Founded by Innventure, Inc. (NASDAQ:INV), Accelsius empowers data center and edge operators to achieve their business, financial and sustainability goals through advanced cooling solutions. The proprietary NeuCool® platform provides best-in-class thermal efficiencies through a safe, two-phase, direct-to-chip liquid cooling system that scales from single racks to entire data centers. For more information, visit accelsius.com or follow us on LinkedIn.
Fonte: Business Wire
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