LAS VEGAS: Ventiva®, a leader in thermal solutions, today announced it is showcasing two new laptop reference designs with Compal at CES 2026. These new designs, which are built around Ventiva’s ionic cooling-based thermal management solutions, are intended to help accelerate the development of laptops that can run advanced AI tasks directly on the device.

AI workloads are reshaping laptop system architecture, with large language models (LLMs), sustained high-power operation, and increasing on-device inference generating concentrated heat that conventional fan-based cooling struggles to manage. Through these collaborative reference designs, Ventiva is demonstrating how its solid-state all-electronic heat transfer technology cools electronic devices without mechanical fans, noise, or vibration – enabling local AI workloads in sleek, silent laptops.

• AI-Ready Laptop Reference Design
  /i>The AI-Ready Laptop reference platform demonstrates how Ventiva’s Zoned Cooling™ design approach reclaims valuable motherboard space, simplifies system construction, reduces total cost of ownership, and delivers thinner, quieter systems without sacrificing performance.
  he laptop is powered by three 62mm Ventiva modules and supports a 28W CPU and 44.3W total platform power in a sub-16 mm chassis. The design accommodates up to a 55 Whr battery, full 2280 SSD support, and Microsoft Copilot+ readiness. The parallel Ventiva array and rear-edge venting reduce impedance, increase cooling efficiency, and create a scalable thermal pathway for future systems.
  ith Ventiva’s Zoned Cooling design, all cooling vents are positioned at the rear of the device, enabling a cleaner internal layout. Bulky mechanical fans, fin stacks, and heat pipes are replaced with Ventiva’s thermal management subsystem. This approach can return up to 7,200 mm² of motherboard real estate, supporting additional memory, storage, larger batteries, or new components. It also reduces system costs through simplified construction and lower inventory requirements, while delivering a lower total cost of ownership with modular, scalable thermal components.