#AdvancedPackaging--The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are...

Siemens EDA, UCIe Consortium, and Sarcina Technology Win the First Annual Chiplet Industry Awards Celebrating Technical Innovation and Excellence
SANTA CLARA, Calif.: #AdvancedPackaging--The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center.
The winners are:
“Chiplet innovation is everywhere,” said Chuck Sobey, General Chair, Chiplet Summit. “We received a wide range of compelling submissions that highlighted advances in design, interoperability, and packaging. We congratulate our winners on their leadership and technical excellence.”
For details on the winners, go to https://chipletsummit.com/2026-best-of-show-awards/
About Chiplet Summit
Chiplet Summit, a product of Semper Technologies, is the industry’s largest chiplet show. It serves the needs of technologists who use chiplets in designs for processors, memories, communications chips, and AI devices. For more information, visit www.chipletsummit.com.
Fonte: Business Wire
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